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DA9280.003 13 July 2006
MAS9280
This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice.
IC FOR 18.00 - 40.00 MHz VCTCXO
* * * * * * Min. Supply Voltage 2.4 V Max. Frequency 40 MHz True Sine Wave Output Frequency Stability +/- 1.5 ppm Suitable Also for Low Pull Crystals Very Low Phase Noise
DESCRIPTION
The MAS9280 is an integrated circuit well suited to build VCTCXO for mobile communication. Temperature calibration is achieved in three calibration temperatures only. The trimming is done through a serial bus and the calibration information is stored in an internal PROM. This means no rework for trimming is needed. To build a VCTCXO additionally only a crystal is required. The compensation method is fully analog, working continuously without generating any steps or other interference. Divider function allows the usage of double frequency crystal.
FEATURES
* * * * * * Very small size Minimum Vdd 2.4V No voltage reference capacitor needed Phase noise <-110 dBc/Hz at 100 Hz and <-130 dBc/Hz at 1kHz @ 32 MHz crystal Programmable VC-sensitivity Oscillator frequency output fo /2 versions available
APPLICATIONS
* * VCTCXO for mobile phones VCTCXO for other telecommunications systems
BLOCK DIAGRAM
DA CLK PV VC
CUB INF SENS LIN
4 4
f(T)
MAS9280
TE1
4
f(T)
8
T
Vref
TMux
TE2
CDAC1
8
VDD
CDAC2
2
OUT X2 X1
VSS
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DA9280.003 13 July 2006
PIN DESCRIPTION
Pin Description Symbol MAS9280A1/ A3 /B1/B3 x-coordinate 268 604 1047 1420 1848 1048 268 796 2020 1701 2058 MAS9280A1/ A3 /B1/B3 y-coordinate 1320 1320 1320 1320 1320 164 164 164 164 164 1320 MAS9280A2 /B2 x-coordinate 268 604 1420 1047 1848 1048 268 796 2020 1701 2058 MAS9280A2 /B2 y-coordinate 1320 1320 1320 1320 1320 164 164 164 164 164 1320
Power Supply Voltage Programming Input Serial Bus Clock Input Serial Bus Data Input Temperature Output Crystal/Varactor Oscillator Input Voltage Control Input Crystal Oscillator Output Buffer Output Power Supply Ground Test Multiplexer Output
VDD PV CLK DA TE1 X2 VC X1 OUT VSS TE2
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. Note: Test Multiplexer Output is for testing only and must not be connected in module.
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Input Voltage Power Dissipation Storage Temperature Note 1: Not valid for programming pin PV Symbol VDD - VSS VIN PMAX TST Min -0.3 VSS -0.3 -55 Max 6.0 VDD + 0.3 20 150 Unit V V mW o C Note 1)
RECOMMENDED OPERATION CONDITIONS
Parameter Supply Voltage Supply Current Operating Temperature Load Capacitance Load Capacitance Crystal Pulling Sensitivity Crystal Rs Symbol VDD ICC TOP CL CL S CRS Conditions Vdd = 2.8 Volt -40 8 10 18 30 50 Min 2.4 Typ 2.6 Max 5.0 1.8 +85 Unit V mA o C pF pF ppm/pF Note
1 2 3
Note 1: MAS9280A1, MAS9280A2 and MAS9280A3 with CDAC1 = 160 ...200 Note 2: MAS9280B1, MAS9280B2 and MAS9280B3 with CDAC1 = 160 ...200 Note 3: At 30 MHz to 40 MHz maximum Rs 30 ohm.
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DA9280.003 13 July 2006
ELECTRICAL CHARACTERISTICS
Parameter Frequency Range Voltage Control Range Voltage Control Sensitivity (VCR = 0) Voltage Control Sensitivity (VCR = 1) Frequency vs. Supply Voltage Frequency vs. Load Change Output Voltage (10k // 10 pF) Harmonic Distortion Compensation Range 2.5 ppm Compensation Range 2.0 ppm Compensation Range 1.5 ppm Compensation Range Linear Part Compensation Inflection Point Compensation Range Cubic Part Compensation CDAC1 (8 Bit) Compensation CDAC2 (2 Bit) Start up Time TC TC TC a1 INF a3 CX1 CX2 TSTART C10 C20 2 -40 -30 -25 -0.7 25 95 C10 + 10.6 C20 + 3 Symbol fo VC VCSENS VCSENS dfo dfo Vout 0.6 1.0 -25 85 85 75 0.0 31 Min 18.00 0 10 5 0.2 0.2 Typ Max 40.00 VDD Unit MHz V ppm/V ppm/V ppm ppm Vpp dBc
o o o
Note 1)
2) 3) 4)
C C C C 5) 6)
ppm/K
o
ppm2/K3 pF pF ms
Note 1: MAS9280B1, MAS9280B2 and MAS9280B3 maximum frequency are 36MHz Note 2: default Note 3: VDD +/- 5% Note 4: R=10 kohm +/- 10%, C=10 pF +/- 10% Note 5: typ C10 = 9.7pF Note 6: typ C20 = 15.2pF
IC OUTLINES
VDD
PV
CLK
DA
TE1
TE2
VDD
PV
DA
CLK
TE1
TE2
1484um
1484um
MAS9280A1/A3 /B2/B3
MAS9280A2 /B2
VC
X1
X2
VSS
OUT
VC
X1
X2
VSS
OUT
Die map reference 2194um
Die map reference 2194um
Note 1: MAS9280A and MAS9280B pads are round with 80 m diameter at opening. Note 2: Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to VDD or left floating and pin TE1 must be left floating in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip.
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DA9280.003 13 July 2006
SAMPLES IN SBDIL 20 PACKAGE
1 2 3 TE2 4
MAS9280A1 YYWW XXXXX.X
20 OUT 19 18 VSS 17 16 X2 15 14 X1 13 12 VC 11
TE1 5 DA 6 CLK 7 PV 8 VDD 9 10
Top marking: YYWW = Year, Week XXXXX.X = Lot number
DEVICE OUTLINE CONFIGURATION
MSOP10 TE2 DA CLK PV VDD OUT VSS X2 X1 VC Top View
A = product version X = pad layout and fo version Y = year WW= week
9280 AX YWW
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DA9280.003 13 July 2006
PACKAGE (MSOP-10) OUTLINE
e S See Detail A c B E1 E1 B E E 5-15 Degrees L1 Detail A A2 A A1 D L G M A A 0 - 8 Degrees Gauge Plane L2 Seating Plane N F Land Pattern Recommendation b1 (b) Section B - B c1
Symbol A A1 A2 b b1 c c1 D E E1 e F G L (Terminal length for soldering) L1 L2 M N S
Min -0.00 0.75 0.15 0.15 0.08 0.08
Nom --0.85 ----
Max 1.10 0.15 0.95 0.30 0.25 0.23 0.18
Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm
0.40
3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 4.8 0.50 0.60
0.80
0.95 REF 0.25 BSC 0.41 1.02 0.50
mm mm mm Mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-187 BA.
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DA9280.003 13 July 2006
SOLDERING INFORMATION
Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 2*220C 240C 2 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 m, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P1 P2
E W F
PO
DO
T
BO
AO
User Direction of Feed
A
D1
Section A-A
KO
Pin 1 Designator
Dimension Ao Bo Do D1 E F Ko Po P1 P2 T W
Min/Max 5.00 0.10 3.20 0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 0.05 1.45 0.10 4.0 8.0 0.10 2.0 0.05 0.3 0.05 12.00 +0.30/-0.10
Unit mm mm mm mm mm mm mm mm mm mm mm mm
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DA9280.003 13 July 2006
REEL SPECIFICATIONS
W2
A
D B
Tape Slot for Tape Start
C
N
W1
5000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative
Carrier Tape Cover Tape End
Start
Trailer
Dimension A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader Min
Components
Max 330 1.5 12.80 20.2 50 12.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 13.50
Leader
Unit mm mm mm mm mm mm mm mm mm
14.4 18.4
Weight
g
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DA9280.003 13 July 2006
ORDERING INFORMATION
Product Code MAS9280A1TG00 MAS9280A1SM06 MAS9280A2TG00 Product IC FOR VCTCXO IC FOR VCTCXO IC FOR VCTCXO, CLK and DA pins swapped round IC FOR VCTCXO, frequency output fo /2 IC FOR VCTCXO, frequency output fo /2 IC FOR VCTCXO IC FOR VCTCXO IC FOR VCTCXO, CLK and DA pins swapped round IC FOR VCTCXO, frequency output fo /2 IC FOR VCTCXO, frequency output fo /2 Comments For 8pF Crystal load For 8pF Crystal load For 8pF Crystal load Package EWS Tested wafers 215 m
MSOP-10, T&R/5000 pcs/r.
EWS Tested wafers 215 m
MAS9280A3TG00 MAS9280A3SM06 MAS9280B1TG00 MAS9280B1SM06 MAS9280B2TG00
For 8pF Crystal load For 8pF Crystal load For 10pF Crystal load For 10pF Crystal load For 10pF Crystal load
EWS Tested wafers 215 m
MSOP-10, T&R/5000 pcs/r.
EWS Tested wafers 215 m
MSOP-10, T&R/5000 pcs/r.
EWS Tested wafers 215 m
MAS9280B3TG00 MAS9280B3SM06
For 10pF Crystal load For 10pF Crystal load
EWS Tested wafers 215 m
MSOP-10, T&R/5000 pcs/r.
Please contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com
NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
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